论文摘要
Diamond/SiC复合材料是一种新型热管理材料,代表着当今先进热管理材料的发展方向。Diamond/SiC复合材料既充分利用了金刚石颗粒较高的热导率,又充分利用了SiC基体良好的综合性能。本文在系统研究Diamond/SiC复合材料工艺设计与反应机理的基础上,国内首次利用真空气相烧结工艺制备出Diamond/SiC复合材料,优化了素坯的模压工艺和原始配方,并对Diamond/SiC复合材料的结构和性能进行了研究。对Diamond/SiC复合材料的烧结工艺进行了优化设计,研究了反应烧结方式、反应烧结温度及保温时间等工艺参数对Diamond/SiC复合材料的影响,确定采用真空气相渗硅烧结工艺,反应温度为1500℃,保温时间1h。研究了烧结过程中金刚石颗粒的石墨化问题,并对硅碳反应机理进行了初步探索,结果表明:反应烧结后,金刚石颗粒保存完整,不存在严重的石墨化。对素坯模压工艺进行了优化研究。选择使用150℃热模压工艺压制素坯。建立了素坯理论孔隙率的计算公式,研究了模压压力对素坯孔隙率和素坯密度的影响,探明了素坯孔隙率对Diamond/SiC复合材料的密度及力学性能的影响。研究表明,模压压力10MPa时,素坯的孔隙率和密度接近理论孔隙率和理论密度,烧结后Diamond/SiC复合材料的密度和力学性能相对较优:金刚石含量40wt%时素坯孔隙率为32%,接近于素坯理论孔隙率33%,制得的Diamond/SiC复合材料密度为3.11 g/cm3,抗弯强度和弹性模量分别为160MPa、175GPa;金刚石含量80wt%时素坯孔隙率为23%,接近于素坯理论孔隙率22%,制得的Diamond/SiC复合材料密度为3.18g/cm3,抗弯强度和弹性模量分别为110MPa、140GPa。对原始配方进行了优化研究。探明了金刚石的品级、粒度、含量等因素对Diamond/SiC复合材料的力学性能、导热性能的影响。研究显示:品级较优的金刚石颗粒制得的Diamond/SiC复合材料具有更好的力学性能和导热性能;Diamond/SiC复合材料的热导率随着金刚石粒径的减小呈递减趋势;随着原始配方中金刚石含量的增多,Diamond/SiC复合材料的力学性能不断下降,而热导率则逐渐增大。选用优品级50目金刚石,金刚石含量为80wt%时,制得Diamond/SiC复合材料的热导率达到280 W/(m·K)。另外,探索了酚醛树脂、硅粉、石墨粉等辅助配料在反应烧结过程中的作用。酚醛树脂的加入量应控制在5-15wt%以内,硅的加入量应控制在30wt%以内,石墨粉的加入量应控制在10wt%以内。对Diamond/SiC复合材料的组成和显微结构进行了分析。Diamond/SiC复合材料由金刚石、SiC、Si三相组成,金刚石颗粒与SiC基体结合紧密,界面紧密牢固,断裂模式为穿晶断裂;金刚石颗粒保存完好,均匀地镶嵌在基体相中。
论文目录
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标签:复合材料论文; 金刚石论文; 真空气相烧结论文; 粒度论文; 模压工艺论文; 孔隙率论文; 热导率论文; 石墨化论文; 显微结构论文;